Aluminum and its alloys are notoriously difficult to solder due to their ability to rapidly form a protective and tenacious surface oxide layer. Superior Flux offers the widest range of aluminum solder pastes on the market, including fluxes for soldering aluminum-to-aluminum, aluminum-to-copper, aluminum-to –brass and aluminum-to-plated terminals.
The concentration and composition of both the flux and the alloying metal depend greatly on the form and series of aluminum to be soldered.
Depending on your application, there are several ways to incorporate aluminum pastes into your process. They include direct aluminum solder paste and direct aluminum tinning paste. In addition to these flux products, Superior Flux offers a non-hazardous aluminum cleaner, which can be used both pre- and post-solder.
Here are a few papers on aluminum soldering, written by our aluminum soldering expert: Direct Aluminum Solder Paste (IMAP Thermal Management Workshop – Palo Alto, CA, 2011) Soldering Aluminum (SME International Brazing & Soldering Conference – Orlando, FL, 2009)
Superior AL26-33-75 direct aluminum solder paste combines aluminum flux and tin-silver solder powder to create an all-in-one aluminum soldering solution, ideal for applications where precision dispensing is required This water-soluble aluminum solder paste was designed for aluminum to copper soldering. The aluminum solder paste creates a true inter-metallic bond between the solder and aluminum substrate. Superior AL26-33-75 solder paste residues are water soluble and must be washed off after soldering.
Superior AL26-103-75 contains a proprietary tin-copper-nickel solder powder (SN100C) for applications using harder to solder aluminum alloys or in cases where a tin-silver solder is cost-prohibitive. Superior AL26-103-75 solder paste residues are water soluble and must be washed off after soldering.
Superior AL26-193-75 is blended with a proprietary low-melting solder alloy that is specifically formulated for the direct soldering of heat sinks. It solders at temperatures under 200°C, thus protecting copper piping built into the heat sink. Most importantly, Superior AL26-193-75 allows for direct Aluminum-to-Aluminum or Aluminum-to-Copper soldering in heat sink fabrication, thus negating the need for plating in heat sink applications. Eliminating plating not only translates into greatly reduced costs, but eliminates the associated hazardous chemicals from the work environment. Superior AL26-193-75 post-solder flux residues are water-soluble and should be cleaned post soldering.
Superior AL2627-103-65 combines our most active aluminum solder paste flux and a proprietary solder powder (SN100C ) to tackle applications using harder to solder aluminum alloys. This special solder powder has been shown to help to solder aluminum in the 2000-, 5000-, and 6000- series. Superior AL2627-103-65 solder paste residues are water soluble and must be washed off after soldering.
Superior AL26-103-25 tinning paste uses a combination of aluminum soldering flux, binder and a proprietary solder powder (SN100C ) to tackle applications using harder to solder aluminum alloys. This direct aluminum tinning paste eliminates the need for costly plating techniques. Superior AL26-103-25 can also be used when soldering thick aluminum surfaces to smaller parts. After it is applied, the larger part is rapidly heated, and the surface cleaned, the smaller or more delicate part can be easily soldered on. Superior AL26-103-25 tinning paste residues are water soluble and must be washed off after use.