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Fusible Alloy Soldering Flux
Superior fusible alloy fluxes are active at room temperature, which make them excellent choices for the tin/bismuth, tin/indium and other low-melt fusible alloys used in fire alarms, sprinkler systems and other safety and fuse applications.
| Superior Flux Number |
Description | Rec. Base Metals |
Rec. Solders |
Rec. Temp Ranges | Specs. | MSDS | Spec. Sheet |
| No. 30 | VOC-Free, Organic Acid | Copper, brass, nickel, some ferrous metals. | Tin/bismuth, other low-melt alloys | 95-315°C 200-600°F |
O-F-506C, Type 1, Form B ORM1 |
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| No. 45 | Alcohol-based, Organic Acid | Copper, brass, nickel, some ferrous metals | Tin/bismuth, other low-melt alloys | 95-315°C 200-600°F |
ORM1 | |
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All fusible alloy soldering fluxes are RoHS compliant.
Superior No. 30 is a water-based fusible alloy flux for tin/bismuth, tin/indium, tin/lead/bismuth/indium and other low melt fusible alloys. No. 30 activates at room temperature and allows the fusible alloy to flow consistently on the surface of fire alarms, sprinkler systems and low-melt applications where 100% reliability is required. Post-solder residues are water-soluble and should be washed off. For more information about the whole family of No. 30 fluxes, go to Superior No. 30 SuperSafe Soldering Flux.
Superior No. 45 is an alcohol-based fusible alloy flux for tin/bismuth, tin/indium, tin/lead/bismuth/indium and other low melt fusible alloys. As an alcohol-based flux, No. 45 evaporates rapidly, promoting effective activity but minimal spattering. No. 45 activates at room temperature and allows the fusible alloy to flow consistently on the surface of fire alarms, sprinkler systems and low-melt applications where 100% reliability is required. Post-solder residues are water-soluble and should be washed off.