Lead-Free No-Clean Solder Paste

Our 592-series No-Clean solder paste is available in two lead-free solder alloys, SAC305 (Sn96.5/Ag3/Cu0.5) and the Sn96.5/Ag3.5.  The SAC305 is currently available in Type 3, Type 4 and Type 5 mesh size; the Sn96.5/Ag3.5 is available in Type 3 mesh size.  Contact us if you need additional mesh sizes.

Our 592-series No-Clean Solder Paste is halide-free yet active enough for a variety of PCBs and environments.  The 592-series solder pastes exhibit superior wetting abilities, lot-to-lot consistency and stable viscosity.  The following tables describe the Lead-Free, No-Clean 592-series solder paste available.  Please note the 592-series is also available with Tin-Lead alloys, as well as with a Low-Temp, Tin-Bismuth-Silver alloy.

Inquire about our full line of Water-Soluble, Lead-Free Solder Paste.  Please note that we can custom blend solder pastes with specific Metal Contents for your particular needs.

No-Clean, SAC-305, Type 3

Solder Paste Product Numbers592-63-885 (Jars, Cartridges, Squeezers)
592-63-86 (Syringes)
Flux TypeNo-Clean
Solder AlloySAC305
Alloy Mesh SizeType 3
Metal Content88.5% (Jars, Cartridges, Squeezers)
86% (Syringes)
SpecificationsREL0 (IPC)
Reflow Temperature Liquidus: 217°C/423°F
Max: 250°C/482°F
SDSSDS 592-63-885 (Jars)
SDS 592-63-86 (Syringes)
TDSTDS 592-63-885 (Jars)
TDS 592-63-86 (Syringes)

No-Clean, SAC-305, Type 4

Solder Paste Product Numbers592-64-8825 (Jars, Cartridges, Squeezers)
592-64-86 (Syringes)
Flux TypeNo-Clean
Solder AlloySAC305
Alloy Mesh SizeType 4
Metal Content88.25% (Jars, Cartridges, Squeezers)
86% (Syringes)
SpecificationsREL0 (IPC)
Reflow TemperatureLiquidus: 217°C/423°F
Max: 250°C/482°F
SDSSDS 592-64-8825 (Jars)
SDS 592-64-86 (Syringes)
TDSTDS 592-64-8825 (Jars)
TDS 592-64-86 (Syringes)

No-Clean, SAC-305, Type 5

Solder Paste Product Numbers592-65-88 (Jars, Cartridges, Squeezers)
592-65-86 (Syringes)
Flux TypeNo-Clean
Solder AlloySAC305
Alloy Mesh SizeType 5
Metal Content88% (Jars, Cartridges, Squeezers)
86% (Syringes)
SpecificationsREL0 (IPC)
Reflow TemperatureLiquidus: 217°C/423°F
Max: 250°C/482°F
SDSSDS 592-65-88 (Jars)
SDS 592-65-86 (Syringes)
TDSTDS 592-65-88 (Jars)
TDS 592-65-86 (Syringes)

No-Clean, Sn96.5/Ag3.5, Type 3

Solder Paste Product Numbers592-33-885 (Jars, Cartridges, Squeezers)
592-33-86 (Syringes)
Flux TypeNo-Clean
Solder AlloySn96.5/Ag3.5
Alloy Mesh SizeType 3
Metal Content88.5% (Jars, Cartridges, Squeezers)
86% (Syringes)
SpecificationsREL0 (IPC)
Reflow TemperatureLiquidus: 221°C/430°F
Max: 250°C/482°F
SDSSDS 592-33-885 (Jars)
SDS 592-33-86 (Syringes)
TDSTDS 592-33-885 (Jars)
TDS 592-33-86 (Syringes)

Pleases review our full line of Electronics Soldering Fluxes & Solder Pastes, including products for PCB Assembly, PCB Fabrication, Semiconductor Fabrication and more.

Superior Flux & Mfg. Co. | 6615 Parkland Blvd. | Cleveland, Ohio 44139 | Tel: (+01) 440.349-3000 | Fax: (+01) 440.349-3003 | info@superiorflux.com